XS22V2-V-Shanghai Sixunited Intelligent Technology Co,Ltd

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XS22V2-V

Whitley 2S2U General Server

XS22V2-V is powered by 2× 3rd Gen Intel Xeon Series Scalable processor server systems. It not only provides high-bandwidth network communication capabilities, but also provides superior scalability and flexibility, while significantly reducing its TCO.

Technical Specifications
Product Introduction
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Commodity name: XS22V2-V
Product Positioning: Whitley 2S2U General Server
Product Serial Number: Server
Platform: Intel
Type: General
Specifications: 2U
List data: Server

Product Code	XS22V2-V
Processor	1 or 2×Intel® 3th Gen Xeon® Scalable Processors Ice Lake，max 270W
Chipset	Intel C621A
Memory	32× DDR4 slots，16 channels，up to 3200MT/s (2DPC) Support RDIMM 1935 LRDIMM DY3DS DIMM too> BPS DIMM
Storage	Support 7x Slimline (x8) PCIe 4.0 3x miniSAS(x4) SATA3 Front: 12x 3.5” or 24x 2.5”SAS/SATA/NVMe HDD, hot-swappable Up to 16× 3.5” SATA HDDs Rear: 2x 2.5”SAT HDD, hot-swappable. Internal: 2x M.2 SSDs(SATA/PCie× 1)
PCIe Expansion	Up to 6x PCIe4.0×16 slots 1x OCP3.0 slot Up to 2x FHFLDW GPU or 8x SFHFLW GPU
Network	1 × 1GbE IPMI RJ45 1 × ocp3.0, 4 × 1GbE / 2 × 10GB SFP / 4 × 10GB SFP / 2 × 25GB sfp28 option
I/O Ports	Front：2× USB3.0, 1× VGA, 1× Power button，1× UID，1× Reset Rear:1 × 1GbE IPMI RJ45,2 × USB3.0, 1 × VGA
Management	AST2500, 1 RJ45 Gigabit management network port
Security	TPM2.0 option
Power	2×Power Modules, support 1 1 redundancy 800W/1300W option
Fan	6×6056 hot-swappable fan modules for N 1 redundancy
Dimension	2U standard rack server W 438mm × H 88mm × D780 mm
Environment	Operating temperatures: 5°C - 35°C

Features

Excellent Performance
Support 2× 3rd Gen Intel scalable processors, TDP up to 270W;
Support 32× DDR4 DIMM, 8-channel，Up to 3200MHz, 6TB; Supports PCIe 4.0 protocol.

Flexible Configuration
Support 6x PCIe4.0 x16 Slots 1x OCP 3.0 Slots;
Support 7xSlimline x8 PCIe4.0 3x miniSAS (x4) SATA3 for storage;
Up to 12x LFF or 24× SFF HDD, hot-swappable;
2×onboard M.2 SATA/PCIe×1 SSD for OS drive.

Stable & Reliable
The modular design improves maintainability and supports a wide range of maintainable parts for toolless operation;
Support N 1 redundancy for power supplies and dissipated heat fans;
Integrated intelligent management chip, support IPMI 2.0, Redfish, SNMP, remote KVM, virtual media, etc.