XS22V3-H3

XS22V3-H3 is a general-purpose 2U2S product based on Intel Eaglestream platform, which provides a cost-effective product option to meet the needs of the mainstream market by modular combinations and cost-optimized design.

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    • 商品名稱: XS22V3-H3
    • 産品定位: EGS 2S2U General Server
    • 産品序号: 服務器
    • 平台: Intel
    • 類型: 通用
    • 規格: 2U
    • 列表數據: 服務器

    XS22V3-H3 is a general-purpose 2U2S product based on Intel Eaglestream platform, which provides a cost-effective product option to meet the needs of the mainstream market by modular combinations and cost-optimized design.

    Product CodeXS22V3-H3
    Processor1 or  2×Intel® 4th & 5th Gen Xeon® Sapphire Rapids/ Emerald Rapids , up to 225W
    ChipsetIntel C741
    Memory16× DDR5 slots, 8 channel per CPU
    Storage

    Front: Up to 12x 3.5" HDD or 24x 2.5" drives

    Rear: Up to 4x 3.5" HDD or 4x 2.5" drives

    Internal: Up to 2x M.2 SSDs (SATA/Nvme)

    PCIe Expansion

    Up to 10x standard PCIe slots and 1x OCP3.0 slot

    Up to 4x DW GPU or 8x SW GPU

    Network

    1×1GbE IPMI RJ45

    2×1GbE RJ45 for internet，

    1× OCP3.0, 4×1GbE / 2×10Gb SFP+ / 4×10Gb SFP+/ 2×25Gb SFP28 option

    I/O Ports

    Front：2× USB3.0, 1× VGA,   1× Power button，1× UID

    Rear：2×1GbE RJ45 for internet，1× 1GbE IPMI RJ45，2× USB3.0, 1× VGA, 1× Console Port  Over RJ45

    ManagementAST2600, 2 xRJ45 GbE management port
    Power2×Standard CRSP Power Modules，1+1 redundancy 
    Fan

    4x hot-swap Fans, N+1 redundancy

    Cold plate optional

    Dimension

    2U standard rack server

     W 447mm × H 86mm × D 840mm

    EnvironmentOperating temperature：5ºC - 35ºC , Up to 45℃ for typical config
    Product CodeXS22V3-H3

  • Features

     

    High Scalability 

    Up to 16x 3.5"  HDDs; 

    Up to 28x 2.5"  or E3.S SSDs; 

    Up to 10x standard PCIe slots and 1x OCP 3.0 slot; 

    Up to 4x DW GPU or 8x SW GPU.  

     

    Reliable Performance 

    225W CPU and 16DIMM DDR5 memory meet the mainstream application require; 

    Expand the memory capacity with CXL technology; Optimized thermal design.  

     

    Cost Efficiency Design 

    Extreme motherboard layers and plates design; 

    Onboard 1GbE network. 

     

     

     

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